Road map updates

Supply Chain. SAP Solution Manager. SAP Landscape Management. SAP Identity Management. Travel - Hospitality. SAP Predictive Analytics. SAP Fiori. SAP Replication Server. SAP Business One.

SAP Distributed Manufacturing. SAP Process Orchestration. Aerospace and Defense. Consumer Products. Defense and Security. Engineering, Construction and Operations. High Tech: OEM. Higher Education and Research. Industrial Machinery and Components. Life Sciences. Mill Products. Oil and Gas. Professional Services. The slide points out the progress made over history with chips technology moving from geometric scaling to back-end-of-the-line BEOL scaling, 3D devices with FinFETS, and finally to heterogeneous integration.

There is also functional diversity, of which heterogeneous integration will be a key enabler. Bottoms did not go into great detail on specifications, or the actual roadmap itself. This was a bit disappointing due to my history of attending most roadmap releases over the history of the ITRS. Figure 4: Chips Act funding status. Figure 4 breaks the total spending down.

As the bill has yet to pass, there is still some discussion on exactly how spending will be broken down, and NIST is taking input on how to best allocate the money. Gayle then went on to discuss a bit on how the industry is broken down on a worldwide basis, which in part helped to decide how the amounts of money above are to be broken down. Figure 5 shows the US Global share, which helped drive the decision to focus on advanced manufacturing and advanced packaging. Figure 5: Global semiconductor industrial assessment.

Gayle then discussed some of the challenges the NIST and other technical government departments have had in explaining semiconductor chips and packaging to government officials. With the shortages in chips for everyday items and automobiles, one would think that our educated elected officials would be able to distinguish a semiconductor chip from a potato chip or a corn chip.

And that perhaps someone on their staff would have enough technical wherewithal to help them understand packaging and advanced packaging, but unfortunately, that is not the case and from Dr. Figure 6: What is advanced semiconductor packaging? The Hero Unit feature was initially meant to be a more extensive version of the current Unit Possession feature, where you would be able to control a unit of your own creation on the field.

Cart 0. Back Team Contact. Down below is a roadmap loosely detailing our plans, please be aware that the plans can change at any time. Now that the game is out of Early Access the updates will be fewer and further between. Neon Weapons and possibly glowing materials in the Unit Creator - Unannounced update - You will like it, we promise.